TOKYO -- Businesswire -- For the commercialization of HRDP®, a special glass carrier for the next-generation semiconductor packaging devices, Mitsui Mining & Smelting Co., Ltd. (President: Keiji Nishida; hereinafter, “Mitsui Kinzoku”) has been expanding the establishment of a system for mass production in collaboration with GEOMATEC Co., Ltd. (President: Kentaro Matsuzaki). Mitsui Kinzoku is pleased to announce today that mass production of HRDP® has started for a domestic multi-chip module manufacturer.
In its January 2018 news release, Mitsui Kinzoku announced the development of HRDP®, a material for the creation of ultra-fine circuits using a glass carrier for the Fan Out panel level package, based on the RDL First method.
HRDP® is a special glass carrier capable of achieving high production efficiency of the Fan Out packages, the next-generation semiconductor packaging technologies, including ultra-high density circuits designed with a line/space (L/S) ratio of 2/2 μm or less. Currently, over 20 customers are evaluating HRDP® for commercialization.
As the first stage, mass production for a domestic multi-chip module manufacturer began in January 2021. This customer will use HRDP® to manufacture devices for the 5G market, which is expected to expand in the future, including RF modules, and other devices for a variety of applications with plans to increase sales.
As the second stage, an overseas leading package manufacturer is planning to adopt HRDP® within FY2021.
In addition, there are plans to initiate the mass production at the other new customers for a variety of applications, such as HPC and mobile phones for FY2022 and onward, and the HRDP® market is expected to expand.
Under its slogan of Material Intelligence, Mitsui Kinzoku will realize customers’ wishes to ensure stable quality and sufficient supply, to provide customers with one stop solutions and to endeavor to increase its market share.
Description of Terms  Abbreviation of High Resolution De-bondable Panel  Re-Distribution Layer First method: Semiconductor chips are packaged after the process of forming the redistribution layer  Fan Out Package: Substrate-less packaging technology with ultra-fine re-distribution layer extended outside the chip size  L/S=2/2 µm: The line width of 2 µm and the space between neighboring circuit lines of 2 µm.  Radio Frequency Module: Product equipped with several active components (IC chips) and passive components (SAW, condenser, resistor and coil) and sealed  High Performance Computing: Computer with large-scale, ultra high-speed computing/processing capability
Reference “Development of HRDP® Material for Formation of Ultra-Fine Circuits with Glass Carrier for Fan Out Panel Level Package” (Release as of January 25, 2018) https://www.mitsui-kinzoku.com/Portals/0/resource/uploads/topics_180125e.pdf?TabModule127
Video of the RDL First method using HRDP® https://www.youtube.com/watch?v=vHhng-NV9QA
Photos/Multimedia Gallery Available: https://www.businesswire.com/news/home/52363593/en
이 뉴스는 기업·기관·단체가 뉴스와이어를 통해 배포한 보도자료입니다.
출처:Mitsui Mining & Smelting Co., Ltd.
Copyright (c) 코리아뉴스와이어, 무단복제 및 재배포 금지
뉴스와이어 주요 뉴스
해당 언론사로 연결됩니다.
- 예스24, ‘이상한 변호사 우영우’ 문지원 대본집 예약 판매 하루 만에 5000부 판매
- 이모션웨이브, 9월 온오프믹스형 ‘뮤직 메타버스 페스티벌’ 개최
- 유튜브 골라라TV, 제주 로컬 마켓 론칭 버라이어티 ‘탐라도서울’ 공개
- 국민체육진흥공단, ‘2022 SPORTS STARTUP 창업교육’ 통해 스포츠 분야 창업 인재 양성
- 특급 호텔 출신 셰프 뭉친 ‘레트로아’, 청담동 차움에 그랜드 오픈
- 한국중앙자원봉사센터 “자원봉사자 2000여명 수해 복구 활동 참여”
- 폰타나, 100% 지중해산 토마토로 만든 빅사이즈 파스타 소스 출시
- 기아-열매나눔인터내셔널, 르완다 주민 대상 ‘그린 라이트 프로젝트’ 결실
- 재규어 TCS 레이싱 팀, 2022 포뮬러 E 세계 챔피언십 E-프리 대회에 참가하기 위해 서울로 출격
- 삼성, 집중 호우 피해 지원 위해 30억원 지원